2013
International Symposium on Physical Design
With a Tribute to Professor Y. Kajitani The Ridge Tahoe, Stateline, Nevada, March 24-27, 2013 www.ispd.cc Sponsored by ACM/SIGDA with Technical Co-Sponsorship from IEEE CAS Additional support from ATopTech, Cadence, IBM Research, Intel Corporation, Mentor Graphics, Oracle, Synopsys, and TSMC | |
TENTATIVE ADVANCE PROGRAMThe International Symposium on Physical Design provides a high-quality forum for the exchange of ideas on the physical layout design of VLSI and biological systems. The scope of this symposium includes all aspects of physical design, from high-level interactions with logic synthesis, down to back-end performance optimization and design for manufacturing. Invited talks are 30 minutes. Regular presentations are 25 minutes. Short presentations (S) are 15 minutes. (EDS) presentations are 15 minutes, followed by a poster session. Best paper nominees are indicated by (bpn). SUNDAY, March 245:30 – 7:00 pm: Evening Reception MONDAY, March 258:30 – 9:45 am: Welcome and Keynote Address Host: Cheng-Kok Koh (Purdue University) Keynote Talk: Heterogeneous 3-D stacking, Can We Have the Best of Both (Technology) Worlds? 9:45 – 10:15 am: Morning Break 10:15 am – 12:05 pm Session 1: 3D Integration and Physical Planning Chair: Markus Olbrich (University of Hannover) (Invited) Physical-Aware System-Level Design for Tiled Hierarchical Chip Multiprocessors Utilizing 2D and 3D Rectilinear Blocks for Efficient IP Reuse and Floorplanning of 3D-Integrated Systems Benchmarking for Research in Power Delivery Networks of Three-Dimensional Integrated Circuits (Invited) High Performance and Low Power Design Techniques for ASIC and Custom in Nanometer Technologies 12:05 – 1:30 pm: Lunch 1:30 – 3:20 pm Session 2: Validation and Design for Yield Chair: Yao-Wen Chang (National Taiwan University) (Invited) Electromigration and Its Impact on Physical Design in Future Technologies (Invited) Data Mining In Design and Test Processes – Basic Principles and Promises SRAM Dynamic Stability Verification by Reachability Analysis with Consideration of Threshold Voltage Variation PushPull: Short Path Padding for Timing Error Resilient Circuits 3:20 – 3:50 pm: Afternoon Break 3:50 – 5:50 pm Session 3: Commemoration for Professor Y. Kajitani Chair: Prof. Yasuhiro Takashima (University of Kitakyushu), Jiang Hu (Texas A&M University) (Invited) Dawn of Computer-aided Design – from Graph-theory to Place and Route (Invited) Practicality on Placement Given by Optimality of Packing (Invited) On the Way to Practical Tools for Beyond Die Codesign and Integration (Invited) Coding the Objects in Place and Route CAD 6:15 – 8:45 pm: Dinner Banquet – Honoring Professor Y. Kajitani Chair: Yasuhiro Takashima (University of Kitakyushu) TUESDAY, March 268:30 – 10:20 am Session 4: Advanced Technologies and Design for Manufacturability Chair: Ting-Chi Wang (National Tsing Hua University) (Invited) Circuit and PD Challenges at the 14nm Technology Node (Invited) Optical Lithography Extension with Double Patterning A Structured Routing Architecture and its Design Methodology Suitable for High-throughput Electron Beam Direct Writing with Character Projection (bpn) Simultaneous OPC- and CMP-aware Routing Based on Accurate Closed-Form Modeling 10:20 – 10:45 am: Morning Break 10:45 am – 12:30 pm Session 5: Routability and Routing Chair: Jackey Yan (Cadence) Planning for Local Net Congestion in Global Routing Escape Routing of Mixed-Pattern Signals Based on Staggered-Pin-Array PCBs Delay-Driven Layer Assignment in Global Routing under Multi-tier Interconnect Structure (S) SRP: Simultaneous Routing and Placement for Congestion Refinement (S) Case Study for Placement Solutions in ISPD11 and DAC12 Routability-Driven Placement Contests |
12:30 – 2:00 pm: Lunch 2:00 – 3:50 pm Session 6: New Frontiers for Physical Design Chair: Ismail Bustany (Mentor Graphics) (Invited) A Compiler for Scalable Placement and Routing of Brain-like Architectures (Invited) Physical Design for Debug: Insurance Policy for ICs A Top-Down Synthesis Methodology for Flow-based Microfluidic Biochips Considering Valve-Switching Minimization (bpn) Designing VeSFET-based ICs with CMOS-oriented EDA Infrastructure 3:50 – 4:15 pm: Afternoon Break 4:15 – 5:45 pm Session 7: Expert Designer/User Session (EDS) Chair: Laleh Behjat (University of Calgary) (EDS) Design and Tuning of a Tree-Mesh Clock Distribution (EDS) Automated Large Block Placement Strategies (EDS) Structured APR: A Hybrid Approach for Efficient Custom Design (EDS) Electrical Variability due to Layout Dependent Effects: Analysis, Quantification, and Mitigation on 40 and 28nm SOC Designs (EDS) iDFM Flow: An ECO Implementation of Metal, Via Filling (EDS) Clock Enable Timing Closure Methodology 5:45 – 6:15 pm EDS Posters and Discussion 6:15 – 8:45 pm: Dinner Banquet WEDNESDAY, March 278:30 – 10:30 am Session 8: Logic, Clock Driven PD and Beyond Chair: Aiqun Cao (Synopsys) (Invited) Relative Timing Driven Multi-Synchronous Design: Enabling Order-of-Magnitude Energy Reduction (bpn) Network Flow Based Datapath Bit Slicing (bpn) FF-Bond: Multi-bit Flip-flop Bonding at Placement Buffer Sizing for Clock Networks Using Robust Geometric Programming Considering Variations in Buffer Sizes (S) Local Merges for Effective Redundancy in Clock Networks 10:30 – 11:00 am: Morning Break 11:00 am – 12:00 pm Session 9: TAU/ISPD Joint Session on Contests Chair: Charles Liu (TSMC) An Improved Benchmark Suite for the ISPD-2013 Discrete Cell Sizing Contest TAU 2013 Variation Aware Timing Analysis Contest 12:00 – 12:10 pm: ISPD Closing Remarks 12:10 – 1:30 pm: TAU/ISPD Keynote and Lunch Chair: Chirayu Amin (Intel Corporation) Opportunities and Challenges for High Performance Microprocessor Designs and Design Automation 1:30 – 2:00 pm: Afternoon Break and TAU Opening Remarks 2:00 – 3:30 pm: TAU/ISPD Invited Session: What Will It Take to Tame the Hierarchical Design Trolls? Chair: Tom Spyrou (Altera) To Do or Not To Do Hierarchical Timing? Variability Aware Hierarchical Implementation of Big Chips Challenges in Managing Timing and Wiring Contracts during Hierarchical Floorplanning and Design Closure |