March 21-24, 2021

General Information

The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, ASICs, FPGAs, and systems-on-chip/systems-in-package. In 2021, the 30th symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field.


The call for papers is available here:

English    Traditional Chinese    Simplified Chinese


Please submit your paper via this link:

ISPD 2021 at EasyChair

Important Dates

Title and abstract submission deadline October 2, 2020
Full manuscript submission deadline October 12, 2020
Acceptance notification November 13, 2020
Camera-ready paper due End of January 2021
Symposium March 21-24, 2021

Sponsors

ACM_SIGDA

Technical Sponsors

IEEE CAS