General Information

The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral- and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, regular fabrics, FPGAs, and systems-on-chip / systems-in-package. Following its twenty-six predecessors, the 2018 symposium will highlight new key directions and leading-edge theoretical and experimental contributions to the field. The ACM Press will publish accepted papers in the Symposium proceedings.
The symposium will pay a tribute to Professor Te C. Hu.
EE Times Coverage of ISPD 2017:    ISPD Predicts Chip Futures    Intel Shows Life Beyond CMOS

Important Dates

Sponsors:

Sponsored by ACM/SIGDA with Technical Co-Sponsorship from IEEE CAS. Additional support from: