March 22-24, 2021
Virtual Conference

General Information

The International Symposium on Physical Design provides a premier forum to exchange ideas and promote research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including its interactions with architecture, behavioral and logic-level synthesis, and back-end performance analysis and verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs, ASICs, FPGAs, and systems-on-chip/systems-in-package. In 2021, the 30th symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the field. We will also pay tribute to Dr. Louis K. Scheffer's outstanding contributions to physical design.


Registration for ISPD 2021 is now open


The call for participation in the ISPD 2021 contest

Important Dates

Title and abstract submission deadline October 5, 2020
Full manuscript submission deadline October 15, 2020 (11:59 pm, your local time)
Acceptance notification November 13, 2020
Camera-ready paper due January 18, 2021
Early registration deadline March 15, 2021
Symposium March 22-24, 2021

Sponsor

ACM_SIGDA

Technical Sponsors

IEEE CEDA IEEE

Supporters

Cadence Hisilicon

Xilinx Siemens

Synopsys TimberWolf

Intel